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Quick Link to CTR Report: Microphotonics: Hardware for the Information Age

Proceedings from the Spring Microphotonics Center Meeting
(April, 2007)

High Volume Photonics:
Drivers and Constraints for the Components-to-Consumer Supply Chain

April 17 & 18, 2007
MIT Campus, Faculty Club


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Day 1 (April 17)

Welcome and Overview
Moderator: Lionel Kimerling, CTR Co-Director
WelcomeIntroduction to CRT II Spring 2007: High Volume Photonics
KeynoteFiber Optics in Cable Television: From Adventure to Maturity
Tony Ley (Chairman, Harmonic, Inc.)
Session I: Roadmaping and Its Products
Moderator: Randolph Kirchain, CTR Co-Director
TWG PaperElectronic-Photonic Convergence on the Silicon Platform
Lionel Kimerling, MIT
TWG PaperEnvisioning the Future of Optoelectronic Interconnects: the Production Economics of InP and Si Platforms for 100G Ethernet LAN Transceivers
Shan Liu, CTR II Fellow

TWG White Paper for download
Shan Liu, Erica Fuchs
TWG PaperDeconstructing Moore's Law: Platform Leaders, True Believers, and Coordinated Innovation - Implications for the Upcoming Decade
Erica Fuchs, PhD, Microphotonics Center Post-doctoral Fellow
PresentationMONA: The European Nanophotonics Technology Roadmap
Bjorn Maes, Ghent University
DiscussionTWG Break-out Meetings

Cross-Market Applications (summary) - Tremont Miao (Analog Devices), Alan Benner (IBM)

Si (CMOS) Platform (summary) - Michael Morse (Intel)

Integration, Packaging & Interconnect (summary) - Louay Eldada (DuPont Photonics), Richard Grzybowski (Corning)
Session II: Market Drivers for Short Reach Interconnects
 Moderator: Alan Benner, IBM
PresentationComputer Games and Virtual Worlds: Trends and Growths of Online Electronic Entertainment
Steven DeBenedictis, Dassault Systemes
PresentationOpportunities in Optics for Mobile Devices
Leo Kärkkäinen, Nokia Research Center
PresentationSAN Interconnects
David Rolston (Reflex Photonics) & Scott Kipp (Brocade)
 Moderator: Tremont Miao, Analog Devices
PresentationOptical Interconnects for Mobile Applications
Julia Yu, Motorola
Presentation160-Gb/s Bidirectional Parallel Optical Transceiver Module for Board Level Interconnects
Fuad Doany, IBM


Day 2 (April 18)

Session III: Technology Solutions to Packaging Challenges
Moderator: Richard Grzybowski, Corning
OverviewSummary Review of Break Out TWG Meetings
PresentationSilicon Photonics: A Platform for Integration, Wafer Level Assembly and Packaging
Mehdi Asghari, Kotura
PresentationInspection of Backplane Fiber-Optic Ferrules
Samir Nayfeh, MIT
PresentationSilicone Polymer Interconnect for Data Communications
Kevin J. Ryan, Dow Corning Corporation
PresentationSOA and Direction for High Density Optical Fiber Interconnects
Bill Blubaugh, US Conec
CloseAnnouncement: CTR II Fall 2007 Meeting Title & Date




For Program Information, contact:

Mindy Baughman

Microphotonics Center Consortium Manager

617.324.6043 mindyb@mit.edu
For Consortium Membership Information, contact:

Dr. George Kenney

Microphotonics Center Associate Director

617.253.3244 gbkenney@mit.edu
CONSORTIUM
MEMBERS


Analog Devices
Corning
Dupont Photonics Technologies

ETRI

Fuji Photo Film
Fujitsu
Hewlett-Packard
IBM
Intel Corporation
Kotura
LioniX
National Semiconductor
NEC
Nortel Networks
siemens
Soitec

MIT